Comparative Reliability of Inkjet-Printed Electronics Packaging

This article compares the thermomechanical behavior of 3-D inkjet-printed microelectronics devices relative to those fabricated from traditional methods. It discusses benefits and challenges in adoption additive manufacturing methods for manufacture conventional approaches. The critical issues related design reliability additively manufactured parts systems stem change process materials utilized. study uses numerical modeling techniques gain insight into these issues. is an extension same topic presented at 2018 IEEE Electronics Packaging Technology Conference. An introduction providing overview area, covering salient academic research activities discussing progress toward commercialization presented. state-of-the-art modular fabrication system developed within EU NextFactory project introduced. has been used several test samples, which were assessed both experimentally numerically. A full series JEDEC tests showed that samples reliable, successfully passing all tests. model assessing mechanical structure during layer-by-layer analysis predicts stresses induced by UV cure are concentrated extremities part and, particular, lower layers constrained print platform. Subsequently, a multilayer undergoing thermal cycling assesses differences properties between FR4/copper acrylic/silver structure. identified influence sintering on subsequent material properties, inject-printed structure, significant. Key findings while inkjet boards relatively similar, board exhibits significantly greater deformation than standard board. Furthermore, strongly dependent elastic modulus sintered silver material, which, turn, process.